Principal Engineer, PD SG Thin Film (CVD/Diffusion)

Main Responsibilities  

• Define and implement technical strategy for structural and electrical film process development aligned to business and technology objectives.  

• Lead multi-functional teams to develop, integrate, and scale thin film processes for advanced NAND structures/devices.  

• Oversee end-to-end development of process modules with focus on manufacturability, scalability, and integration readiness.  

• Resolve complex technical challenges with significant business implications (root cause analysis, mitigation of process/device failures).  

• Drive technology transfer and ramp-up activities to enable transition from R&D to high-volume manufacturing.  

• Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process/material utilization.  

Other Responsibilities  

• Mentor senior engineers and influence technical direction across the organization.  

• Represent the function in technical forums and strategic collaborations; benchmark against industry standards.  

• Identify emerging trends/risks/opportunities and recommend future investments/critical initiatives.  

• Integrates AI assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. 

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI enabled enhancements within one’s scope of work. 

AI Responsibilities:

• Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work.

Candidate Profile 

Minimum Qualifications / Experience 

• PhD ≥5 yrs, or Master’s ≥7 yrs, or Bachelor’s ≥10 yrs of relevant experience in 
  Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field,  

• With demonstrated experience in Thin Films R&D/PD for NAND including CVD and Diffusion thin films 

Must-Have Technical Skills 

• Mastery of thin film deposition (ALD/CVD) for high-density NAND applications; process design/optimization/integration.  

• Advanced characterization capability (examples cited: XRR, ellipsometry, SEM, TEM, SIMS, XPS) and electrical evaluation methods (leakage/impedance/capacitance/breakdown).  

• Proficiency in SPC/DOE/data analytics for optimization and fixing.  

• Ability to drive novel chemistries/materials/hardware solutions (e.g., chamber design, plasma source optimization, gas delivery).  

Must-Have Soft Skills 

• Technical leadership through influence; strong cross-functional and cross-site collaboration.  

• Mentorship and clear executive-ready technical communication.  

Highly Desirable / Preferred 

• Competitive benchmarking / industry trend assessment translating into actionable roadmaps.

AI Requirements

• Ability to apply baseline digital fluency and role appropriate AI literacy to use AI enabled tools responsibly and effectively for research, analysis, content creation, problem solving, operational tasks, and achieving business outcomes.

Embody Micron’s Core Values: 

• People – Diversity of thought to propel technology leadership - Ideas can come from anywhere

• Innovation – Challenge and disrupt the status quo – fail fast and learn faster, optimize with Artificial Intelligence solutions

• Tenacity – Own the problem to closure through a first principles approach

• Collaboration – Partner with Product and Manufacturing to deliver end-to-end technology solutions

• Customer Focus – Powering Micron’s Storage products through industry-leading technology

• Speed – Moving fast on what matters, without compromising quality